Design steps
A typical IC design cycle involves several steps:
- Feasibility study and die size estimate
- Functional verification
- Circuit/RTL design
- Circuit/RTL simulation Logic simulation
- Floorplanning
- Design review
- Layout
- Layout verification
- Static timing analysis
- Layout review
- Design For Test and Automatic test pattern generation
- Design for manufacturability (IC)
- Mask data preparation
- Wafer fabrication
- Die test
- Packaging
- Post silicon validation
- Device characterization
- Tweak (if necessary)
- Datasheet generation Portable Document Format
- Ramp up
- Production
- Yield Analysis / Warranty Analysis Reliability (semiconductor)
- Failure analysis on any returns
- plan for next generation chip using production information if possible
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